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PZUxBA series
Single Zener diodes
Rev. 01 -- 19 September 2008 Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package.
1.2 Features
I Non-repetitive peak reverse power dissipation: PZSM 40 W I Total power dissipation: Ptot 320 mW I Tolerance series: B: approximately 5 %; B1, B2, B3: approximately 2 % I Wide working voltage range: nominal 2.4 V to 36 V (E24 range) I Low reverse current IR range I Small plastic package suitable for surface-mounted design I AEC-Q101 qualified
1.3 Applications
I General regulation functions
1.4 Quick reference data
Table 1. Symbol VF PZSM Ptot
[1] [2] [3]
Quick reference data Parameter forward voltage non-repetitive peak reverse power dissipation total power dissipation Tamb 25 C Conditions IF = 100 mA
[1] [2]
Min -
Typ -
Max 1.1 40 320
Unit V W mW
[3]
Pulse test: tp 300 s; 0.02. tp = 100 s; square wave; Tj = 25 C prior to surge Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
NXP Semiconductors
PZUxBA series
Single Zener diodes
2. Pinning information
Table 2. Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
1 2
Graphic symbol
1
2
006aaa152
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3. Ordering information Package Name PZU2.4BA to PZU36BA[1] PZU2.4BA/DG to PZU36BA/DG[1][2]
[1] [2] The series consists of 97 types with nominal working voltages from 2.4 V to 36 V. /DG: halogen-free
Type number
Description plastic surface-mounted package; 2 leads
Version SOD323
SC-76
PZUXBA_SER_1
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Product data sheet
Rev. 01 -- 19 September 2008
2 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
4. Marking
Table 4. Marking codes Marking code B PZU2.4*A PZU2.7*A PZU3.0*A PZU3.3*A PZU3.6*A PZU3.9*A PZU4.3*A PZU4.7*A PZU5.1*A PZU5.6*A PZU6.2*A PZU6.8*A PZU7.5*A PZU8.2*A PZU9.1*A PZU10*A PZU11*A PZU12*A PZU13*A PZU14*A PZU15*A PZU16*A PZU18*A PZU20*A PZU22*A PZU24*A PZU27*A PZU30*A PZU33*A PZU36*A
[1]
Type number[1]
Type number[1] B2 XB XV XY MD MG MP MU MY LH LN LT LX CS CW VC VG VM VS VU VX X2 X6 XE XK XP B3 MR MV MZ LK LP LU LY CT CX VD VH VN VT VY X3 X7 XF XL XR PZU2.4*A/DG PZU2.7*A/DG PZU3.0*A/DG PZU3.3*A/DG PZU3.6*A/DG PZU3.9*A/DG PZU4.3*A/DG PZU4.7*A/DG PZU5.1*A/DG PZU5.6*A/DG PZU6.2*A/DG PZU6.8*A/DG PZU7.5*A/DG PZU8.2*A/DG PZU9.1*A/DG PZU10*A/DG PZU11*A/DG PZU12*A/DG PZU13*A/DG PZU14*A/DG PZU15*A/DG PZU16*A/DG PZU18*A/DG PZU20*A/DG PZU22*A/DG PZU24*A/DG PZU27*A/DG PZU30*A/DG PZU33*A/DG PZU36*A/DG
Marking code B Y8 Y9 YT YW YZ NE NM NS NW RF RL RR RV RZ EU WA WE WK WP WV WZ Y4 YC YG YM YS NH NK NL B1 YA YU YX NC NF NN NT NX RG RM RS RW ER EV WB WF WL WR WW Y1 Y5 YD YH YN B2 YB YV YY ND NG NP NU NY RH RN RT RX ES EW WC WG WM WS WU WX Y2 Y6 YE YK YP B3 NR NV NZ RK RP RU RY ET EX WD WH WN WT WY Y3 Y7 YF YL YR -
B1 XA XU XX MC MF MN MT MX LG LM LS LW CR CV VB VF VL VR VW X1 X5 XD XH XN -
X8 X9 XT XW XZ ME MM MS MW LF LL LR LV LZ CU VA VE VK VP VV VZ X4 XC XG XM XS MH MK ML
* = B: tolerance series B, approximately 5 % * = B1, B2, B3: tolerance series B1, B2, B3: approximately 2 %
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
3 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol IF IZSM Parameter forward current non-repetitive peak reverse current non-repetitive peak reverse power dissipation total power dissipation junction temperature ambient temperature storage temperature
tp = 100 s; square wave; Tj = 25 C prior to surge Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[1]
Conditions
Min -
Max 200 see Table 8 and 9 40 320 490 150 +150 +150
Unit mA
PZSM Ptot Tj Tamb Tstg
[1] [2] [3]
[1]
-55 -65
W mW mW C C C
Tamb 25 C
[2] [3]
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Rth(j-sp)
[1] [2] [3]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air
[1] [2] [3]
Min -
Typ -
Max 390 255 55
Unit K/W K/W K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Soldering point of cathode tab.
7. Characteristics
Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol VF Parameter forward voltage IF = 10 mA IF = 100 mA
[1] Pulse test: tp 300 s; 0.02.
Conditions
[1]
Min -
Typ -
Max 0.9 1.1
Unit V V
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
4 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
Table 8. Characteristics per type; PZU2.4BA to PZU5.6B3A and PZU2.4BA/DG to PZU5.6B3A/DG Tj = 25 C unless otherwise specified. PZUxBA Sel Working voltage VZ (V) IZ = 5 mA Min 2.4 2.7 B B B1 B2 3.0 B B1 B2 3.3 B B1 B2 3.6 B B1 B2 3.9 B B1 B2 4.3 B B1 B2 B3 4.7 B B1 B2 B3 5.1 B B1 B2 B3 5.6 B B1 B2 B3
[1] [2]
Differential resistance Reverse rdif () current IR (A) IZ = 0.5 mA IZ = 5 mA Max 1000 1000 Max 100 100 Max 50 20 VR (V) 1 1
Temperature Diode coefficient capacitance SZ (mV/K) Cd (pF)[1] IZ = 5 mA Typ -1.6 -2.0 Max 450 440
Non-repetitive peak reverse current IZSM (A)[2] Max 8 8
Max 2.6 2.9 2.75 2.9 3.2 3.05 3.2 3.5 3.35 3.5 3.8 3.65 3.8 4.1 3.97 4.10 4.48 4.21 4.34 4.48 4.9 4.61 4.75 4.9 5.37 5.04 5.2 5.37 5.92 5.55 5.73 5.92
2.3 2.5 2.5 2.65 2.8 2.8 2.95 3.1 3.1 3.25 3.4 3.4 3.55 3.7 3.7 3.87 4.01 4.01 4.15 4.28 4.42 4.42 4.55 4.69 4.84 4.84 4.98 5.14 5.31 5.31 5.49 5.67
1000
95
10
1
-2.1
425
8
1000
95
5
1
-2.4
410
8
1000
90
5
1
-2.4
390
8
1000
90
3
1
-2.5
370
8
1000
90
3
1
-2.5
350
8
800
80
2
1
-1.4
325
8
250
60
2
1.5
0.3
300
5.5
100
40
1
2.5
1.9
275
5.5
f = 1 MHz; VR = 0 V tp = 100 s; square wave; Tj = 25 C prior to surge
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
5 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
Table 9. Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG Tj = 25 C unless otherwise specified. PZUxBA Sel Working voltage VZ (V) IZ = 5 mA Min 6.2 B B1 B2 B3 6.8 B B1 B2 B3 7.5 B B1 B2 B3 8.2 B B1 B2 B3 9.1 B B1 B2 B3 10 B B1 B2 B3 11 B B1 B2 B3 12 B B1 B2 B3 13 B B1 B2 B3
PZUXBA_SER_1
Differential resistance Reverse rdif () current IR (nA) IZ = 0.5 mA IZ = 5 mA Max 80 Max 30 Max 500 VR (V) 3
Temperature Diode coefficient capacitance SZ (mV/K) Cd (pF)[1] IZ = 5 mA Typ 2.7 Max 250
Non-repetitive peak reverse current IZSM (A)[2] Max 5.5
Max 6.53 6.12 6.33 6.53 7.14 6.73 6.93 7.14 7.84 7.36 7.60 7.84 8.64 8.1 8.36 8.64 9.55 8.93 9.23 9.55
5.86 5.86 6.06 6.26 6.47 6.47 6.65 6.86 7.06 7.06 7.28 7.52 7.76 7.76 8.02 8.28 8.56 8.56 8.85 9.15 9.45 9.45 9.77
60
20
500
3.5
3.4
215
5.5
60
10
500
4
4.0
170
3.5
60
10
500
5
4.6
150
3.5
60
10
500
6
5.5
120
3.5
10.55 60 9.87 10.21
10
100
7
6.4
110
3.5
10.11 10.55 10.44 11.56 60 10.44 10.88 10.76 11.22 11.1 11.56 80 10 100 9 8.4 105 3 11.42 12.6 11.42 11.9 11.74 12.24 12.08 12.6 12.47 13.96 80 12.47 13.03 12.91 13.49 13.37 13.96
(c) NXP B.V. 2008. All rights reserved.
10
100
8
7.4
108
3
10
100
10
9.4
103
2.5
Product data sheet
Rev. 01 -- 19 September 2008
6 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
Table 9. Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG ...continued Tj = 25 C unless otherwise specified. PZUxBA Sel Working voltage VZ (V) IZ = 5 mA Min 14 15 B2 B B1 B2 B3 16 B B1 B2 B3 18 B B1 B2 B3 20 B B1 B2 B3 22 B B1 B2 B3 24 B B1 B2 B3 27 30 33 36
[1] [2]
Differential resistance Reverse rdif () current IR (nA) IZ = 0.5 mA IZ = 5 mA Max Max 10 15 Max 100 50 VR (V) 11 11
Temperature Diode coefficient capacitance SZ (mV/K) Cd (pF)[1] IZ = 5 mA Typ 10.4 11.4 Max 101 99
Non-repetitive peak reverse current IZSM (A)[2] Max 2 2
Max
13.70 14.30 80 13.84 15.52 80 13.84 14.46 14.34 14.98 14.85 15.52 15.37 17.09 80 15.37 16.01 15.85 16.51 16.35 17.09 16.94 19.03 80 16.94 17.7 17.56 18.35 18.21 19.03 18.86 21.08 100 18.86 19.7 19.52 20.39 20.21 21.08 20.88 23.17 100 20.88 21.77 21.54 22.47 22.23 23.17 22.93 25.57 120 22.93 23.96 23.72 24.78 24.54 25.57 25.1 28 31 34 28.9 32 35 38 150 200 250 300
20
50
12
12.4
97
1.5
20
50
13
14.4
93
1.5
20
50
15
16.4
88
1.5
25
50
17
18.4
84
1.3
30
50
19
20.4
80
1.3
B B B B
40 40 40 60
50 50 50 50
21 23 25 27
23.4 26.6 29.7 33.0
73 66 60 59
1 1 0.9 0.8
f = 1 MHz; VR = 0 V tp = 100 s; square wave; Tj = 25 C prior to surge
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
7 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
103 PZSM (W) 102
006aab215
300 IF (mA) 200
mbg781
10
100
1 10-4
10-3 tp (s)
10-2
0 0.6
0.8 VF (V)
1
Tj = 25 C (prior to surge)
Tj = 25 C
Fig 1.
Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values
mgl273
Fig 2.
Forward current as a function of forward voltage; typical values
0 SZ (mV/K) -1
10 12 SZ (mV/K) 5 11 10 9.1 8.2 7.5 6.8
mgl274
4.3
3.9 3.6
6.2 5.6 5.1 4.7
-2
3.3 3.0 2.4 2.7
0
-3
-5 0 20 40 IZ (mA) 60
0
4
8
12
16
IZ (mA)
20
Tj = 25 C to 150 C VZ = 2.4 V to 4.3 V
Tj = 25 C to 150 C VZ = 4.7 V to 12 V
Fig 3.
Temperature coefficient as a function of working current; typical values
Fig 4.
Temperature coefficient as a function of working current; typical values
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
8 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
102 IZ (mA) 10 VZ(nom) (V) = 2.4 3.0 2.7 3.3
006aab246
102 IZ (mA) VZ(nom) (V) = 4.7
006aab247
3.6 3.9
4.3
10 5.6 6.8 6.2 8.2 7.5 9.1 10 11 12
1
1
5.1
10-1
10-1
10-2
10-2
10-3 0 1 2 3 4 VZ (V) 5
10-3 0 2 4 6 8 10 12 14 VZ (V)
Tj = 25 C VZ = 2.4 V to 4.3 V
Tj = 25 C VZ = 4.7 V to 12 V
Fig 5.
Working current as a function of working voltage; typical values
102 IZ (mA) 10 14 15 16 18 20 22 24 VZ(nom) (V) = 13
Fig 6.
Working current as a function of working voltage; typical values
006aab248
27 30
33 36
1
10-1
10-2
10-3 10 20 30 VZ (V) 40
Tj = 25 C VZ = 13 V to 36 V
Fig 7.
Working current as a function of working voltage; typical values
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
9 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
9. Package outline
1.35 1.15 1 0.45 0.15 1.1 0.8
2.7 2.3
1.8 1.6
2 0.40 0.25 Dimensions in mm 0.25 0.10 03-12-17
Fig 8.
Package outline SOD323 (SC-76)
10. Packing information
Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PZU2.4BA to PZU36BA PZU2.4BA/DG to PZU36BA/DG
[1] For further information and the availability of packing methods, see Section 13.
Package SOD323
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 10000 -135
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
10 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
11. Soldering
3.05 2.1 solder lands solder resist 1.65 0.95 0.5 (2x) 0.6 (2x) solder paste occupied area 2.2 0.5 (2x) 0.6 (2x) Dimensions in mm
sod323_fr
Fig 9.
Reflow soldering footprint SOD323 (SC-76)
5 2.9 1.5 (2x) solder lands solder resist occupied area
2.75
1.2 (2x)
Dimensions in mm preferred transport direction during soldering
sod323_fw
Fig 10. Wave soldering footprint SOD323 (SC-76)
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
11 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
12. Revision history
Table 11. Revision history Release date 20080919 Data sheet status Product data sheet Change notice Supersedes Document ID PZUXBA_SER_1
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
12 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
13.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PZUXBA_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 19 September 2008
13 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 Quality information . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information. . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 September 2008 Document identifier: PZUXBA_SER_1

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